| Stencil Life |
12-18 hours |
| Tack Time |
18-24 hours |
| Solder
Alloys |
Sn60/Pb40; Sn63/Pb37;
Sn62/Pb36/Ag2; Sn96.5/Ag3.5; Sn10/Pb88/Ag2; Sn95/Sb5;
Sn43/Pb43/Bi14 |
| Melting
Temperatures |
Sn63/Pb37: 183°C
Sn62/Pb36/Ag2: 179°C
Sn96.5/Ag3.5: 221°C
Sn10/Pb88/Ag2: 268-290°C
Sn95/Sb5: 235-240°C
Sn43/Pb43/Bi14: 144-163°C |
| Appearance |
Homogenous dark gray
cream, no separated flux |
| Flux
Content (wt %) |
Printing Applications
9.5-10.5% +/-1%
Dispensing Applications 13% +/-1%
Tested according to IPC-TM-650 2.2.20 |
| Viscosity |
Printing Applications,
T2,T2A 750Kcps +/-10% T3 800Kcps +/-10% T4 850Kcps +/-10%;
Dispensing Applications, T2,T2A 400Kcps +/-10% T3 425Kcps
+/-10% T4 450Kcps +/-10%.
Tested according to IPC-TM-650 2.4.34 and 2.4.34.2 |
| Grain
Size |
T2, -200/+325, 75-45microns
T2A, -270/+400, 53-38microns
T3, -325/+500, 45-25 microns
T4, -400/+500, 38-25 microns,
T5, -500/+635, 25-20 microns
Tested according to IPC-TM-650 2.2.14 and 2.2.14.2 |
| Particle
Sphericity |
99% of the powder spheres
exceed 80% roundness factor |
| Chlorine
Content in Flux (%) |
Pass – IPC-TM-650
2.3.33, Less than 2.5 mg/in2 via Ion Chromatography. |
| Flux Designation/Copper
Mirror |
REMO as
classified by IPC-TM-650 2.3.32 |
| Insulation
Resistance |
Greater than 1x10-11
after humidity exposure.
Tested according to IPC-TM-650 2.6.3.3 |
| Reflow
Property |
The paste shall coalesce
into one button with no visible discoloration |
Lead Free
Electronic
