More on BOW 60 No Clean Solder Paste

Solder Balling:

Per J-STD-005 referred (no solder balls)

Residue Properties:

Flux Activity:

According to IPC-SF-818 Class L

Copper Mirror:

Per IPC-SF-818 Pass

Silver Chromate Test Paper:

Per IPC- SF-818 Pass

Recommended Processing Guidelines:

Cleaning:

The flux residues may remain on circuit. They do no need to be cleaned. Clean wet paste with isopropanol or similar solvents

Typical (Sn63 /Pb37) Reflow Profile

If the printing interval exceeds 1 hour, remove the paste from the stencil.
The printed solder paste remains tacky for up to 8 hours to allow device insertion The exact time depends on environmental conditions
If the printed circuit boards will be stored for more than 6 hours after populating and prior to reflow. It is advisable to store the boards in a tightly closed area. This is especially important if the the humidity exceeds 65%. Humidity should ideally be controlled between 45-65%.

Reflow Parameters:

For optimum results, the paste should be reflowed at a peak temperature of 30-50°C above the liquidous temperature of the alloy. Time above liquidous should be maintained for 30-60 seconds. Heating should be uniform across the substrate and components. Reflow can be accomplished with any industry accepted process.

Packaging:

Available in 250, 500 and 100 gram jars 6 ounce and 12 ounce cartridges.

Storage:

Store in refrigeration at 5-12°C. Avoid direct sunlight and temperatures exceeding 35°C. Allow paste to come to room temperature for a minimum of 2 hours prior to opening. Store syringes and cartridges vertically with the tips down.

Safety:

When using do not eat, drink, or smoke. Avoid contact with skin and eyes. Wear suitable gloves and eye protection. Contains lead!

Warranty:

Material guaranteed to meet specifications for 5 months from date of shipment.