96/4 Lead Free Tin Solder

96.5% Tin / 3.5% Silver & 96% Tin / 4% Silver

DESCRIPTION

Tin/Silver Alloys are compatible with most major electronic grade fluxes on the market today, and are available in paste and wire form in no-clean, water soluble and rosin chemistries.                                                                                                                

FEATURES 

  • Excellent resistance
  • Excellent solder joint reliability
  • High Purity
  • Compatible with most flux types
  • Mfg. to J-Std-006

TEMPERATURE REQUIREMENTS

APPLICATION

RECOMMENDED TEMPERATURE

REFLOW SOLDERING

PEAK TEMPERATURE 240 – 250 C (464 – 482 F)

WAVE SOLDERING

POT TEMPERATURE OF 260 C (500 F)

HAND SOLDERING

TIP TEMPERATURE OF 355 – 410C (700 – 800F)