No Clean Solder Flux

Description: 

BOW No-Clean flux is a low residue formula for use in flux-cored solder wire. Features of this flux are instant wetting action and a clear, non-corrosive residue. This flux is ideal for hand soldering and rework applications. It is formulated with a resin polymer and dendrimer activator.

FEATURES

  • High activity RA formulation
  • Excellent solderability for a wide variety of applications
  • Classified as ROM1 per J-STD-006

AVAILABILITY        

No-Clean may be obtained in a wide array of Sn/Pb and Lead Free alloys, in diameters from .009 to .125 in flux percentages from 1.1% to 3.6%, packaged on 1, 5, and 20 pound spools.

RELIABILITY PROPERTIES        

Silver Chromate:         Pass
Corrosion:                      Pass
Polyglycols:               None
Appearance:                 Clear
Water Extract Resistivity: (ohm-cm)  32,000
Flux designation:     ROLO
Halogen Content:         Pass

 

 STORAGE AND SHELF LIFE

Store in any dry, non-corrosive environment. Cored wire solder has a shelf life of 2 years from date of manufacture.