Description:
BOW® Electronics water-soluble RMA core flux has excellent activity levels coupled with easy post-solder cleaning. Post-solder residues can be left on surface for up to 72 hours after solder, but we recommend cleaning take place as soon after soldering as is possible. Post solder residues are easily removed with DI water at 60°C/140°F without saponifies or detergents.
FEATURES
- Excellent wetting on copper
- Post-solder residues completely water-soluble
- Compatible with tin-lead and lead-free alloys
- Suitable for all electronic applications
- Excellent solderability to a wide range of metallization
- Environmentally friendly, non-hazardous
APPLICATIONS
This flux is recommended for use in any electronic hand soldering application where high fluxing strength and water cleanability are desired. The thermal stability of the core provides excellent soldering over a wide range of temperatures, however optimum results are achieved between 500-650°F.
AVAILABILITY
Available in standard tin-lead and lead-free alloys in diameters from 0.006” to 0.125”. Packaged on 1,5, or 20 lb. spools.
RELIABILITY PROPERTIES
Silver Chromate: Pass
Corrosion: Pass
Polyglycols: None
Appearance: Clear
Water Extract Resistivity: (ohm-cm) 32,000
Flux designation: ROLO
Halogen Content: Pass
STORAGE AND SHELF LIFE
Store in a dry, non-corrosive environment. Store in plastic containers away from heat, sparks, or open flame. Do not store or place flux in contact with metals. Store flux in an area with controlled temperature between 18-25°C/64-77°F. Cored wire solder has a shelf life of 2 years from the date of manufacture.
