Our lead free alloys are available in bar, preforms, wire, and spheres. BOW’s manufacturing process frees the alloy of impurities for lower surface tension and stronger solder joints.
BOW® Electronic Lead Free products meet or exceed the requirements of IPC/J-STD-006C.
![SAC 305](/assets/components/phpthumbof/cache/25_Bow_1_Net_032_SAC.62db62c049be501ad6ec10a57de676bb.jpg)
SAC 305
SAC Alloys are the leading alloys replacing tin-lead solders for electronic assembly applications.
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![BLF227®](/assets/components/phpthumbof/cache/26_Bow_1_Net_062_BLF.62db62c049be501ad6ec10a57de676bb.jpg)
BLF227®
BOW® Electronic Solders has developed BLF 227®, a low-cost lead free alloy available in core, solid and bar.
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![96/4](/assets/components/phpthumbof/cache/nbow-3.62db62c049be501ad6ec10a57de676bb.jpg)
96/4
Tin/Silver Alloys are compatible with most major electronic grade fluxes on the market today.
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![Pure Tin](/assets/components/phpthumbof/cache/30_Bow_1_Net_040.62db62c049be501ad6ec10a57de676bb.jpg)
![CN100C](/assets/components/phpthumbof/cache/Bow_1_CN100C.ef4634deab4fe6de2b016281aab771aa.png)
CN100C
CN100C is our newest, low cost, silver-free alloy with a Germanium additive. It is a drop in replacement for SN100C.
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![60/40](/assets/components/phpthumbof/cache/28_Bow_1_Net_062%20%282%29.62db62c049be501ad6ec10a57de676bb.jpg)
60/40
60/40 is a tin-lead solder suitable for use in many electrical and non-electrical commercial soldering applications.
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![63/37](/assets/components/phpthumbof/cache/27_Bow_1_Net_032.62db62c049be501ad6ec10a57de676bb.jpg)
63/37
63/37 has a eutectic melting/solidification point and is one of the easiest solders to work with.
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