Rosin Liquid Flux

BOW 625 Flux

BOW 625 is a non-activated rosin flux, composed of pure water-white gum rosin and isopropyl alcohol. This flux meets all the requirements of Type R flux per MIL- F-14256D. It also meets J-STD–004 Type ROLO.

BOW 625 can be used on all critical and sensitive electronic assemblies where flux residue removal is not feasible. This flux is recommended for use in tin stranded wire, component leads and touch-up work for printed circuits. It can also be used as a solderability test flux for quality control of incoming PC boards and component leads.

BOW 640 Flux

BOW 640 is a non-activated rosin flux composed of pure water-white gum rosin and isopropyl alcohol. It meets all the requirements of Type R flux per MIL- F-14256D. It also meets J-STD –004 Type ROLO. BOW 640 can be used on all critical and sensitive electronic assemblies where flux residue removal is not feasible. This flux is recommended for use in tin stranded wire, component leads and touch-up work for printed circuits.

BOW 785 Flux

BOW 785 is a mildly-activated rosin flux is formulated to meet the requirements of high-speed soldering operations; with activities close to that of a fully activated rosin flux. This flux meets the requirements of type RMA per MIL-F-14256. It also is classified as "ROM1" in J-Std-004. It is excellent for tinning stranded wire, component leads and attaching lead frames to hybrid circuit assemblies.

BOW 1025, 1035, & 1050 Flux

BOW 1025, 1035 and 1050, under MIL-F-14256, was QPL approved as Type RMA. Although the fluxing ability approaches that of Type RA flux, the flux residue after soldering is non-corrosive and non-conductive.

Each of these rosin fluxes has been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. These fluxes possess high thermal stability for soldering multi-layer assemblies which require a high preheat temperature. Exposure to high preheat temperatures do not degrade solubility of the residue in normal cleaning solvents. There is no surface insulation resistance degradation caused by the flux residue. The use of a minimum of ionic activating agents and the inactive nature of the residue permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.