BOW® No-Clean flux is a low residue formula for use in flux-cored solder wire. Features of this flux are instant wetting action and a clear, non-corrosive residue. This flux is ideal for hand soldering and rework applications. It is formulated with a resin polymer and dendrimer activator.
- High activity RA formulation
- Excellent solderability for a wide variety of applications
- Classified as ROM1 per J-STD-004
No-Clean may be obtained in a wide array of Sn/Pb and Lead Free alloys, in diameters from .006 to .125 in flux percentages from 1.1% to 3.6%, packaged on 1, 5, and 20 pound spools.
|Water Extract Resistivity: (ohm-cm)||32,000|
STORAGE AND SHELF LIFE
Store in any dry, non-corrosive environment. Cored wire solder has a shelf life of 2 years from date of manufacture.