Description:
BOW® No-Clean flux is a low residue formula for use in flux-cored solder wire. Features of this flux are instant wetting action and a clear, non-corrosive residue. This flux is ideal for hand soldering and rework applications. It is formulated with a resin polymer and dendrimer activator.
FEATURES
- High activity RA formulation
- Excellent solderability for a wide variety of applications
- Classified as ROM1 per J-STD-004
AVAILABILITY
No-Clean may be obtained in a wide array of Sn/Pb and Lead Free alloys, in diameters from .006 to .125 in flux percentages from 1.1% to 3.6%, packaged on 1, 5, and 20 pound spools.
RELIABILITY PROPERTIES
| Silver Chromate: | Pass |
| Corrosion: | Pass |
| Polyglycols: | None |
| Appearance: | Clear |
| Water Extract Resistivity: (ohm-cm) | 32,000 |
| Flux designation: | ROLO |
| Halogen Content: | Pass |
STORAGE AND SHELF LIFE
Store in any dry, non-corrosive environment. Cored wire solder has a shelf life of 2 years from date of manufacture.
