An organic acid, water soluble flux core wire, developed for tin-lead and lead-free alloys. It was designed for general-purpose hand solder and rework applications. This is particularly useful for soldering to bare copper and excessively oxidized metals or other hard to solder surfaces. The high fluxing activity and fast action of this, results in increased productivity and less solder consumption. After soldering, residues can be removed with hot water and no saponifier or detergent is required.
FEATURES AND BENEFITS
- Excellent Wetting
- Completely water-soluble
- Compatible with tin-lead and lead-free alloys
- Suitable for all electronic applications
- Environmental friendly
- Excellent solderability to a wide range of metallization
- Thermal stability for use with standard or high temperature alloys
- Conforms to IPC J-STD-004, Type ORH1
This solder is recommended for use in any electronic hand soldering application where high fluxing strength and water cleanability are desired. The thermal stability of the core provides excellent soldering over a wide range of temperatures, however optimum results are achieved between 500-650°F. Post solder residues must be cleaned and are easily removed with hot water at 60°C/140°F (and higher) without saponifiers or detergents.
Available in standard tin-lead and lead-free alloys, in diameters from 0.010” to 0.125” on 1, 5 and 20 pound spools.
STORAGE AND SHELF LIFE
Store in a dry, non-corrosive environment. Cored wire solder has a shelf life of 2 years from the date of manufacture.